![Sputtering Target Bonding Products](http://himet-materials.com/cdn/shop/products/Target_Bonding_Services_{width}x.png?v=1580434040)
Rectangular and Round Sputtering Target Bonding services offered.Backing plate designed and fabricated as per your specifications.
Material: OFHC copper, Standard round Cu backing plate discs are 0.125 in thickness. Backing plate diameter is 3/8" larger than Target diameter
Available with Indium solder bonding for high thermal conductivity and cheaper Ag paste bonding
Send us your CAD drawing for a quote
Order with needed Sputter targets