High Quality, Lowest Cost Sputter & PLD Targets, Evaporation & Single Crystal materials , Ceramic machining, Sputtering Systems & Thermal evaporators for SEM Sample Preparation and thin film research

Sputtering Target Bonding Products

Sputtering Target Bonding Products

Regular price
Sale price
Unit price

This takes 30 days to ship

Rectangular and Round  Sputtering Target Bonding services offered.Backing plate designed and fabricated as per your specifications.

Material: OFHC copper, Standard round Cu backing plate discs are 0.125 in thickness. Backing plate diameter is 3/8" larger than Target diameter

Available with Indium solder bonding for high thermal conductivity and cheaper Ag paste bonding

Send us your CAD drawing for a quote

Order with needed Sputter targets

Price includes backing plate + Bonding