Rectangular and Round Sputtering Target Bonding services offered.Backing plate designed and fabricated as per your specifications.
Material: OFHC copper, Standard round Cu backing plate discs are 0.125 in thickness. Backing plate diameter is 3/8" larger than Target diameter
Available with Indium solder bonding for high thermal conductivity and cheaper Ag paste bonding
Send us your CAD drawing for a quote
Order with needed Sputter targets